![]() | |||
|
2 Kwi-1 Micro SIM kunye nekhadi le-SD Isiqhagamshelo, 8P, H2.26mm Izinto: I-Insulator:I-Thermoplastic yeTemp ePhezulu, UL94V-0.Mnyama. Itheminali:I-Copper Alloy, iGold plating kwindawo yoqhagamshelwano 1u”,Indawo yokuThengisa i-1u” Iqokobhe eliPhezulu:Intsimbi engatyiwa, iNickel yePlate 50u". Iqokobhe eliPhantsi:SUS304 R-1/2H T=0.10mm, iPlate Nickel 50u". Umbane: Amandla oFakelo 1kgf Max.Ukurhoxiswa kwamandla 0.1kgf Min. Ukuqina:ISIM 5000 imijikelo, Ukuchasana noQhagamshelwano: Phambi kokuvavanya i-80mΩ Max, Emva kovavanyo 120Ω Max. Ukuxhathisa i-Insulation: 1000MΩ Ukumelana neVoltage: 500V AC Ngemizuzu eyi-1. Ubushushu bokusebenza: -45ºC ~ +85ºC |
Icandelo elinguNomb. | Inkcazo | PCS/CTN | GW(KG) | CMB(m3) | UmyaleloQty. | Ixesha | Umyalelo |