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Iziqhagamshelo zekhadi leSIM & neziqhagamshelo zekhadi leSIM eliNcinci & neziQhagamshelwano zeNano SIM khadi

Isidibanisi sekhadi leSIM encinci, i-6Pin H1.42mm KLS1-SIM-105

IMifanekiso yeMveliso yoLwazi lweMveliso isiQhagamshelwano seMicro SIM khadi,6Pin H1.42mm Izinto: Insulator:Ubushushu obuphezulu Thermoplastic,UL 94V-0 Qhagamshelana: Ingxubevange yobhedu, iPlated 50u” Ni Ooverall Qhagamshelana Au 1U Shell:SUS,Plated 50u” Ni Ooverall,Plated 1uMbane oMbane ukukala:0.5mA AC/DC max Voltage rating:125V AC/DC Ambient Temperature Range:-20°C~+60°C Storage Ubushushu Uluhlu:-40°C~+70°C Ambient Humidity Uluhlu:95% RH max Qhagamshelana resi...

Ikhadi leSIM encinci CONN,6P,H1.45mm,SMD KLS1-SIM-046

IMifanekiso yeMveliso yeMveliso yeMveliso yoMathiriyeli: Izindlu: LCP,UL94V-0 Qhagamshelana:C5210 , I-Gold Flash ePlated kwiNdawo yoQhagamshelwano; I-Gold Flash Plating Kwimisila ye-Solder; Nge-Entrre Qhagamshelana ne-Underplated Nickel Shell:SUS304,Nickel Underplated Phezu kwayo yonke, I-Gold Flash ePletiwe kwiMisila yeSolder Iimpawu zoMbane: Umlinganiselo wangoku:0.5A Umlinganiselo weVoltage:5V ukuQhagamshelana Ukumelana:50mΩ Max. Ukumelana ne-Insulation: 1000MΩ Min Durabiliy:3000 Imijikelo Min

Isidibanisi sekhadi leSIM encinci, 8Pin H1.5mm, uhlobo oluHingwe KLS1-SIM-089

IMifanekiso yeMveliso yoLwazi lweMveliso iMicro SIM Card Isiqhagamshelo,8Pin H1.5mm,Uhlobo oluHinged Material Housing:Thermoplastic,UL94V-0. Itheminali:Phosphor Bronze,T=0.15,Ni iPlated Ngaphantsi,Au iPlated kwiNdawo yoQhagamshelwano,G/F ePlated kwiSoldertail. Iqokobhe:Intsimbi Engatyiwayo,T=0.15,Ni Plated Ngaphantsi,G/F Yalekwe KwiSoldertail. Ukunyangwa koMbane:60mΩ Ubukhulu. Ukuxhathisa i-Insulation: 1000MΩ Min. I-Dielectric Withstanding Voltage: 500V AC nge-1 Minute. Ukuqina:5000 Imijikelo. Ubushushu bokusebenza: -45ºC ~ +85ºC

Isiqhagamsheli sekhadi leSIM encinci, i-6Pin H1.8mm, uhlobo oluHingwe KLS1-SIM-072

Imifanekiso yeeMveliso zoLwazi lweMveliso iMicro SIM khadi isiqhagamshelo,6Pin H1.8mm,Uhlobo oluHinged Material: Izindlu: LCP,UL94V-0,Black. Itheminali:Ingxubevange yobhedu. Iqokobhe:Intsimbi engatyiwayo. Umbane: Umlinganiselo wangoku:1A Max. Ubungakanani bombane:30V DC max. Ukuchasana noQhagamshelwano:30mΩ Ubukhulu. Ukuxhathisa i-Insulation: 1000MΩ Min. I-Dielectric Voltage: 500V rms / min. Ukuqina:5000 Imijikelo. Ubushushu bokusebenza: -45ºC ~ +85ºC

Isidibanisi sekhadi leSIM encinci,6Pin H1.5mm, uhlobo lweTreyi KLS1-SIM-075

IMifanekiso yeMveliso yoLwazi lweMveliso iMicro SIM khadi Isiqhagamshelo,6Pin H1.5mm,Isixhobo sohlobo lweTreyi: Isigqubuthelo:Hi–IiPlastiki yoBubushushu,UL94V-0,Mnyama. Itheminali:I-Copper Alloy.I-Gold Flash Plating kuyo yonke i-terminal,Aad 50u” min Nickel Ifakwe ngaphantsi kwi-allover. Umbane: Umlinganiselo wangoku: 0.5A Umlinganiselo weVoltage: 5.0 vrms I-Insulation Resistance: 1000MΩ Min./500V DC Withstanding Voltage: 250V ACrms For 1Minute Contact Res...

Isiqhagamsheli sekhadi leSIM eNcinci,6P,PUSH TSHA,H1.5mm KLS1-SIM-099

IMifanekiso yeMveliso yoLwazi lweMveliso iMicro SIM Card Connector,6P,PUSH PULL,H1.5mm Material Housing:Thermoplastic,UL94V-0. Itheminali:Ingxubevange yobhedu,iGold ePlated kwiNdawo yoQhagamshelwano kunye nemisila yeSolder,Nickel ePlated ngokubanzi. Iqokobhe:Intsimbi EngenaStainless.Nickel ePlated Gqirha.IGoldPlated Kwimisila yeSolder. Umbane: Umlinganiselo wangoku:1.0 A max. Ukuchasana noQhagamshelwano:30mΩ Ubukhulu. I-Dielectric Withstanding Voltage:500V AC Insulation Resistance:1000MΩ Min./500V DC Ubushushu bokusebenza: -45ºC~+85ºC

Isidibanisi sekhadi leSIM encinci,8P,PUSH TSHA,H1.5mm KLS1-SIM-091

IMifanekiso yeMveliso yoLwazi lweMveliso iMicro SIM Card Isiqhagamshelo,8P,PUSH PULL,H1.5mm yoMbane: Ilinganiswe ngoku:1.0A Ixabiso lombane:30V Ukuchasana noQhagamshelwano:50mΩ Max. I-Insulation Resistance:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Solder abiltiy:250oC~%%P5oC,10%%P0.5s Ukuqina:5000 Cycles Min. Ukuchasa uQhagamshelwano: 50mΩ Ubukhulu. Ubushushu bokusebenza: -45ºC ~ +85ºC

Isidibanisi sekhadi leSIM encinci, i-6P

Imifanekiso yeMveliso

Isidibanisi sekhadi leSIM encinci, i-6P

Imifanekiso yeMveliso

Isidibanisi sekhadi leSIM encinci,8P

Imifanekiso yeMveliso

Isidibanisi sekhadi leSIM encinci,8P

Imifanekiso yeMveliso

Isidibanisi sekhadi leSIM encinci,8P

Imifanekiso yeMveliso

Isidibanisi sekhadi leSIM encinci, i-6P

Imifanekiso yeMveliso

Isidibanisi sekhadi leSIM eliNcinci;PUSH PUSH,6P+1P Okanye 8P+1P,H1.50mm KLS1-SIM-090

IMifanekiso yeMveliso yoLwazi lweMveliso iMicro SIM khadi Isidibanisi;PUSH PUSH,6P +1P Okanye 8P + 1P, H1.50mm Umlinganiselo wangoku woMbane: 0.5A Umlinganiselo weVoltage: 5.0 vrms Ukuchasana noQhagamshelwano: 100mΩ Max. Ukumelana ne-Insulation: 1000M Min. Ukumelana neVoltage: 250V ACrms nge-1 Minute. Uluhlu lweTempile eSebenzayo:-45℃-+105℃ Isixhobo:Isigqubuthelo:Iplastiki yeHi-Temperature,UL94V-0,Itheminali emnyama:Ingxubevange yobhedu,iGold Flash Plating kuyo yonke iTheminali, kunye ne-50u” min nickel efakwe ngaphantsi kwe-alover.Igobolondo:Intsimbi engatyiwa,50u&...

Isidibanisi sekhadi leSIM eNcinci;PUSH PUSH,6P Okanye 6P+1P,H1.35mm KLS1-SIM-069

Imifanekiso yeeMveliso zoLwazi lweMveliso yeMicro SIM khadi Isidibanisi;PUSH PUSH,6P Okanye 6P +1P,H1.35mm,Ngaphandle kweposi. Material: I-Insulator:High Temperature Thermoplastic,UL94V-0 Qhagamshelana:I-Copper Alloy,Plated 50U” Ni Overall Contact Au 1U Shell:SUS,Plated 50U” Ni Overall Plated 1u” Au Selective Contact Area yoMbane: Umlinganiselo wangoku: 0.5A Maxsu. Ukumelana: 1000M Min./500VDC Uluhlu lokufuma kwe-Ambient: 95% RH Max.

I-Micro SIM Card Connector 8P,PUSH TSHA,H2.4mm KLS1-SIM-044-8P

IMifanekiso yeMveliso yoLwazi lweMveliso yeMicro SIM Card Connector 8P,PUSH PULL,H2.4mm Material: Isiseko:Hi-Temp Thermoplastic,UL94V-0.Black. UQhagamshelwano lweDatha:Ingxubevange yobhedu,iGold Plated. Iqokobhe:Intsimbi engatyiwa,iGold Plated. Umbane: Ukumelana noQhagamshelwano:50mΩ eqhelekileyo, 100Ω Ubukhulu. I-Insulation Resistance:>1000MΩ/500V DC. 3.Isigaba soMphunga:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ukuthengiswa ngesandla:370ºC.3sec.Max. Ubushushu bokusebenza: -45ºC ~+105ºC

I-Micro SIM Card Connector 6P,PUSH TSHA,H2.4mm KLS1-SIM-044-6P

Imifanekiso yeeMveliso zoLwazi lweMveliso yeMicro SIM Card Isidibanisi 6P,PUSH PULL,H2.4mm Material: Isiseko:Hi-Temp Thermoplastic,UL94V-0.Black. UQhagamshelwano lweDatha:Ingxubevange yobhedu,iGold Plated. Iqokobhe:Intsimbi engatyiwa,iGold Plated. Umbane: Ukumelana noQhagamshelwano:50mΩ eqhelekileyo, 100Ω Ubukhulu. I-Insulation Resistance:>1000MΩ/500V DC. 3.Isigaba soMphunga:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Ukuthengiswa ngesandla:370ºC.3sec.Max. Ubushushu bokusebenza: -45ºC ~+105ºC

Isiqhagamsheli sekhadi leSIM;PUSH PUSH,6P+2P,H1.80mm,Ngeposi okanye Ngaphandle kweposi. KLS1-SIM-110

Imifanekiso yeMveliso yeMveliso yoLwazi lweKhadi yeSIM Isidibanisi;PUSH PUSH,6P+2P,H1.80mm Ngeposi okanye Ngaphandle kweposi. Izinto eziphathekayo: Izinto zeNdlu: I-LCP UL94V-0 Izinto zoQhagamshelwano: I-Tin-Bronze Package: I-Tape kunye ne-Reel Package Iimpawu zoMbane: Umlinganiselo we-Voltage: 100V AC Umlinganiselo wangoku: 0.5A Max Ukumelana nombane: 250V AC/1Minute Insulation resistance0: ≩0 Ukuxhathisa i-Insulation ≩1 ≩0 Ukuxhatshazwa ≩Τ0 ≩1 Ubomi: ＞5000 Imijikelo yoBubushushu bokusebenza: -45ºC ~+85ºC

Isiqhagamsheli sekhadi leSIM, PUSH PUSH,8P+1P,H1.9mm, ngePost KLS1-SIM-108

IMifanekiso yeMveliso yoLwazi lweMveliso yeSidibanisi seKhadi le-SIM, PUSH PUSH, 8P + 1P, H1.9mm, kunye nePost Material: Izindlu: Hi-Temp Plastic, UL94V-0.Rated. Uqhagamshelwano:Ingxubevange yobhedu. Igobolondo: Ingxubevange yobhedu. Ukucwenga: Indawo yoQhagamshelwano:Isibane segolide. Indawo yeSolder:80u” Min, Matte tin alloy plated. Ngaphantsi kwepleyiti:30u” min,Nickel. I-Shell:30u” Min,Nickel epleyitiwe iyonke indawo yeSoda:Iflash yeGole.UMbane:Ireyithingi yangoku:0.5A.Ukumelana neVoltage:AC500Vrms Ukumelana ne-Insulation:1000MΩMin,At DC 500V Qhagamshelana...

Isiqhagamsheli sekhadi leSIM, PUSH PUSH,6P+1P,H1.9mm, kunye nePost KLS1-SIM-107

IMifanekiso yeMveliso yoLwazi lweMveliso yeSidibanisi seKhadi le-SIM, PUSH PUSH, 6P + 1P, H1.9mm, ngePost Material: Izindlu: Hi-Temp Plastic, UL94V-0.Rated. Uqhagamshelwano:Ingxubevange yobhedu. Iqokobhe:Ingxubevange yobhedu/intsimbi. Ukucwenga: Indawo yoQhagamshelwano:Isibane segolide. Indawo yeSolder:80u” Min, Matte tin alloy plated. Ngaphantsi kwepleyiti:30u” min,Nickel. I-Shell:30u” Min,Nickel epleyitiwe iyonke indawo yeSoda:Iflash yeGoli.UMbane:Ireyithingi yangoku:0.5A.Ukumelana neVoltage:AC500Vrms Ukumelana ne-Insulation:1000MΩMin,Kwi-DC 500V Qhuba...

Isidibanisi sekhadi leSIM;PUSH PUSH,6P,H1.85mm KLS1-SIM-106

Imifanekiso yeMveliso yeMveliso yeNkcazelo yeKhadi ye-SIM Isidibanisi, iPUSH PUSH, 6P, H1.85mm, kunye nePost Housing: Hi-Temp Plastic, UL94V-0.Rated. Uqhagamshelwano:Ingxubevange yobhedu. Iqokobhe:SUS. Gqiba: Igolide ebekwe kwindawo edityaniswe kuyo, iTin ebekwe kwimisila yesolder.

Isidibanisi sekhadi leSIM, PUSH PUSH, 6P, H1.85mm, ngaphandle kwePost KLS1-SIM-087

IMifanekiso yeMveliso yoLwazi lweMveliso yeSidibanisi seKhadi le-SIM, PUSH PUSH, 6P, H1.85mm, ngaphandle kwezinto zokuThumela: I-Insulator: H-Temperature Plastic, UL94V-0.Black. UQhagamshelwano: Ingxubevange yobhedu,T=0.15mm Igobolondo:Intsimbi engatyiwa,T=0.15mm Finsh: Itheminali:50u” min Nickel Ifakwe Ngaphantsi kwi-Allover,iGold Plating kwi-Contact Arer,80u” min Tin on Solder Tail. I-Shell:50u” Nickel Ifakwe Ngaphantsi Kwi-Allover,I-Gold Flash kwi-Solder Latch Umbane: Umlinganiselo wangoku:0.5A.

Isiqhagamsheli sekhadi leSIM,PUSH PUSH,6P+2P,H1.85mm, ngaphandle kwePost KLS1-SIM-086

Imifanekiso yeMveliso yeMveliso yeNkcazelo yeKhadi ye-SIM Isidibanisi, iPUSH PUSH, 6P + 2P, H1.85mm, ngaphandle kwezinto zePost Material: I-Insulator: H-Temperature Plastic, UL94V-0.Black. UQhagamshelwano: Ingxubevange yobhedu,T=0.15mm Igobolondo:Intsimbi engatyiwa,T=0.15mm Finsh: Itheminali:50u” min Nickel Ifakwe Ngaphantsi kwi-Allover,iGold Plating kwi-Contact Arer,80u” min Tin on Solder Tail. I-Shell:50u”Nickel iNgaphantsi kwi-Allover,I-Gold Flash kwi-Solder Latch Umbane: Umlinganiselo wangoku:0.5A.

Isidibanisi sekhadi leSIM, PUSH PUSH,8P+2P,H1.85mm, ngaphandle kwePost KLS1-SIM-085A

Imifanekiso yeeMveliso zeMveliso yeNkcazelo yeKhadi ye-SIM iSidibanisi, iPUSH PUSH, 8P + 2P, H1.85mm, ngaphandle kwezinto zokuThumela: I-Insulator: H-Temperature Plastic, UL94V-0.Black. UQhagamshelwano: Ingxubevange yobhedu,T=0.15mm Igobolondo:Intsimbi engatyiwa,T=0.15mm Finsh: Itheminali:50u” min Nickel Ifakwe Ngaphantsi kwi-Allover,iGold Plating kwi-Contact Arer,80u” min Tin on Solder Tail. I-Shell:50u”Nickel iNgaphantsi kwe-Allover,I-Gold Flash kwi-Solder Latch Umbane: Umlinganiselo wangoku:0.5A.
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