CONN MICRO USB 2P R/A DIP KLS1-4250
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| Izinto eziphathekayo Indawo yokuhlala:IHing Temperature Thermoplastics,Mnyama. Uqhagamshelwano: Ingxubevange yobhedu C1591. Igobolondo: Ingxubevange yobhedu C2680/SPCC. Gqiba: Qhagamshelana:IGold ePlated kwiNdawo yokuTyaniswa;Itoti kwiiTalls zeSolder. Shell:Nickel Plating. Umbane: Ireyithingi yangoku:1.5A/Itheminali yoQhagamshelwano. Amandla ombane:30V DC Ukuchasana noQhagamshelwano:30mΩ Ubukhulu. I-Dielectric Withstanding Voltage: 500 V AC kwiNqanaba loLwandle. Ukuxhathisa i-Insulation: 1000MΩ Min. Isidibanisi iMate kunye ne-Unmated Force Amandla oMlingane: 3.57kgf Ubukhulu. Amandla Angadibananga:1.02kgf Min. |
| Icandelo elinguNomb. | Inkcazo | PCS/CTN | GW(KG) | CMB(m3) | UmyaleloQty. | Ixesha | Umyalelo |
