CONN PLUG IMICRO USB UHLOBO B ISolder T3.0,L8.8mm KLS1-235-2
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Izinto eziphathekayo Indawo yokuhlala: I-Hing Temperature Thermoplastics, UL94V-0 LCP,Mnyama. Uqhagamshelwano: Ingxubevange yobhedu C2680. Igobolondo: Ingxubevange yobhedu C2680/SPCC. Gqiba: Qhagamshelana: IGold ePlated kwiNdawo yokukhwelana; I-Tin kwiiTall zeSolder. Shell:Nickel Plating. Umbane: Ireyithingi yangoku:1.5A/Itheminali yoQhagamshelwano. Amandla ombane:30V DC Ukuchasana noQhagamshelwano:30mΩ Ubukhulu. I-Dielectric Ukumelana nombane: I-500 V AC KWINqanaba loLwandle. Ukuxhathisa i-Insulation: 1000MΩ Min. Isidibanisi iMate kunye ne-Unmated Force Amandla oMlingane: 3.75kgf Ubukhulu. Amandla Angadibananga:1.02kgf Min. Ugcino lwetheminali:1.2kgf Min. |
Icandelo elinguNomb. | Inkcazo | PCS/CTN | GW(KG) | CMB(m3) | UmyaleloQty. | Ixesha | Umyalelo |