Isidibanisi sekhadi leSIM, PUSH PUSH,8P+1P,H1.85mm, ngaphandle kwePost KLS1-SIM-074B
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| Isidibanisi sekhadi leSIM, PUSH PUSH,8P+1P,H1.85mm, ngaphandle kwePosi Izinto: Izindlu:Ubushushu obuphezulu Thermoplastic, UL94V-0.Mnyama. Uqhagamshelwano:Ingxubevange yobhedu. Ikhava:Uqhagamshelwano:Iingxubevange zobhedu okanye intsimbi. Ukucwenga: Ngaphantsi:Nickel. Indawo yoQhagamshelwano:Igolide ngaphezulu kweNikeli. Indawo yeSolder:Tin phezu kweNikeli. Iqokobhe:Ipleyiti yeG/F eNgaphaya kweNikeli kwimisila yeSolder Umbane: Umgangatho wangoku: 0.5A. Umlinganiselo wombane:5.0 Vrms. I-Insulation Resistance: 500M Min.At DC 500V DC Ukumelana neVoltage: 250V ACrms ngeMizuzu eyi-1. Ukuchasana noQhagamshelwano: 100M Max.At 10MA/20mVMAX. Ubushushu bokusebenza: -45ºC ~ +85ºC Imijikelo yokukhwelana: 5000 Ukufakwa. |
| Icandelo elinguNomb. | Inkcazo | PCS/CTN | GW(KG) | CMB(m3) | UmyaleloQty. | Ixesha | Umyalelo |
